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Patent Assignment Abstract of Title
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Total Assignments: 5
Patent #:
8884422
Issue Dt:
11/11/2014
Application #:
12651365
Filing Dt:
12/31/2009
Publication #:
20110156250
Pub Dt:
06/30/2011
Inventors:
Kim-Yong Goh, Jing-En Luan
Title:
FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE
Assignment: 1
Reel/Frame:
024082/0955Recorded: 03/15/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GOH, KIM-YONG
Exec Dt:
01/28/2010
LUAN, JING-EN
Exec Dt:
01/28/2010
Assignee:
STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
5A SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554574
Correspondent:
HAROLD H. BENNETT II
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
027119/0143Recorded: 10/25/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GOH, KIM-YONG
Exec Dt:
08/31/2011
LUAN, JING-EN
Exec Dt:
08/31/2011
Assignee:
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
HAYLEY J. STEVENS
701 FIFTH AVENUE
SUITE 5400
SEATTTLE, WA 98104
Assignment: 3
Reel/Frame:
027119/0146Recorded: 10/25/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Exec Dt:
10/04/2011
Assignee:
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
HAYLEY J. STEVENS
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 4
Reel/Frame:
057777/0820Recorded: 10/13/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS PTE LTD
Exec Dt:
10/07/2021
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
39, CHEMIN DU CHAMP DES FILLES
1228 PLAN-LES-OUATES
GENEVA, SWITZERLAND
Correspondent:
RAJ K. KRISHNAN
750 CANYON DRIVE SUITE 300
COPPELL, TX 75019
Assignment: 5
Reel/Frame:
058298/0235Recorded: 10/25/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS INTERNATIONAL N.V.
Exec Dt:
10/16/2021
Assignee:
BELL SEMICONDUCTOR, LLC
ONE WEST BROAD STREET
SUITE 901
BETHLEHEM, PENNSYLVANIA 18018
Correspondent:
SCOTT WIDDOWSON
ONE WEST BROAD STREET
SUITE 901
BETHLEHEM, PA 18018

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