Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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12859635
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Filing Dt:
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08/19/2010
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Publication #:
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Pub Dt:
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06/30/2011
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Inventors:
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Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Title:
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SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN |
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EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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