Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/12/2013
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Application #:
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12805628
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Filing Dt:
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08/10/2010
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Publication #:
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Pub Dt:
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07/21/2011
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Inventors:
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Seung Wook Park, Young Do Kweon, Kyung Seob Oh, Seung Wan Shin, Mi Jin Park
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Title:
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INTERCONNECTION STRUCTURE, INTERPOSER, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING INTERCONNECTION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG, YEONGTONG-GU |
| SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVENUE, N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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