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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12881845
Filing Dt:
09/14/2010
Publication #:
Pub Dt:
08/11/2011
Inventors:
Kevin P. Lyne, Stanley Craig Beddingfield, Elida I. De Obaldia et al
Title:
SEMICONDUCTOR WAFER CHIP SCALE PACKAGE TEST FLOW AND DICING PROCESS
Assignment: 1
Reel/Frame:
024985/0883Recorded: 09/14/2010Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/2010
Exec Dt:
08/30/2010
Exec Dt:
08/25/2010
Exec Dt:
08/30/2010
Exec Dt:
08/30/2010
Assignee:
7839 CHURCHILL WAY
MS 3999
DALLAS, TEXAS 75251
Correspondent:
DR. PETER MCLARTY, ESQ.
7839 CHURCHILL WAY
MS 3999
DALLAS, TX 75251

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