Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
13043782
|
Filing Dt:
|
03/09/2011
|
Publication #:
|
|
Pub Dt:
|
09/15/2011
| | | | |
Inventors:
|
YU-LIN YANG, LIH-MING DOONG
|
Title:
|
FLIP CHIP PACKAGE STRUCTURE WITH HEAT DISSIPATION ENHANCEMENT AND ITS APPLICATION
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5F, NO. 20, TAI YUEN STREET |
CHUPEI CITY |
HSINCHU 310, TAIWAN R.O.C. |
|
|
|
ROSENBERG, KLEIN & LEE |
3458 ELLICOTT CENTER DRIVE-SUITE 101 |
ELLICOTT CITY MD 21043 |
|
|
Search Results as of:
09/25/2024 02:11 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|