Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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13111966
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Filing Dt:
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05/20/2011
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Publication #:
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Pub Dt:
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09/22/2011
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Inventors:
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Charles W.C. Lin, Chia-Chung Wang, Ming Yu Shih
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH THERMAL VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 10 ANSON ROAD #47-14 |
| SINGAPORE, 079903 SINGAPORE |
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