Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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13010880
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Filing Dt:
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01/21/2011
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Publication #:
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Pub Dt:
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10/06/2011
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Inventors:
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Hsiu-Wen Tu, Chung-Hsien Hsin, Ming-Hui Chen, Chih-Cheng Hsu, Young-Houng Shiao et al
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Title:
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MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 84, TAI-HO RD., CHU-PEI |
| CHU-PEI CITY, HSIN-CHU HSIEN, TAIWAN 30267 |
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| JUAN CARLOS A. MARQUEZ |
| 1199 N. FAIRFAX STREET, SUITE 900 |
| STITES & HARBISON PLLC |
| ALEXANDRIA, VA 22314 |
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