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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8828777
Issue Dt:
09/09/2014
Application #:
13012967
Filing Dt:
01/25/2011
Publication #:
20110241147
Pub Dt:
10/06/2011
Inventors:
Hsiu-Wen Tu, Chung-Hsien Hsin, Tsao-Pin Chen, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo et al
Title:
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Assignment: 1
Reel/Frame:
025690/0834Recorded: 01/25/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TU, HSIU-WEN
Exec Dt:
12/27/2010
HSIN, CHUNG-HSIEN
Exec Dt:
12/27/2010
CHEN, HAN-HSING
Exec Dt:
12/27/2010
CHEN, MING-HUI
Exec Dt:
12/27/2010
KUO, REN-LONG
Exec Dt:
12/27/2010
HSU, CHIH-CHENG
Exec Dt:
12/27/2010
SHIAO, YOUNG-HOUNG
Exec Dt:
12/27/2010
CHEN, TSAO-PIN
Exec Dt:
12/27/2010
Assignee:
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD.
CHU-PEI, HSIN-CHU HSIEN, TAIWAN 30267
Correspondent:
JUAN CARLOS A. MARQUEZ
1199 N. FAIRFAX STREET, SUITE 900
STITES & HARBISON PLLC
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
062119/0661Recorded: 12/14/2022Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
KINGPAK TECHNOLOGY INC.
Exec Dt:
08/26/2022
Assignee:
TONG HSING ELECTRONIC INDUSTRIES, LTD.
6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST.
TAIPEI CITY, TAIWAN 100011
Correspondent:
MCCLURE, QUALEY & RODACK LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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