Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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12758702
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Filing Dt:
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04/12/2010
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Publication #:
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Pub Dt:
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10/13/2011
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Inventors:
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Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Title:
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SURFACE MOUNT DEVICE THIN PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6F, PHOTONICS CENTRE, NO. 2 SCIENCE PARK EAST AVENUE |
HONG KONG SCIENCE PARK |
HONG KONG, CHINA |
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JAYE G. HEYBL |
KOPPEL, PATRICK, HEYBL & DAWSON |
2815 TOWNSGATE ROAD, SUITE 215 |
WESTLAKE VILLAGE, CA 91361 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TCL INDUSTRIAL AREA, NO. 21 JIANGBEI YUNSHAN EAST RD. |
HUIZHOU MUNICIPALITY, GUANGDONG PROVINCE, CHINA |
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KOPPEL PATRICK HEYBL & DAWSON |
2815 TOWNSGATE ROAD |
SUITE 215 |
WESTLAKE VILLAGE, CA 91361 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO. 38 HECHANG LIU ROAD EAST |
ZHONGKAI HIGH-TECH INDUSTRIAL DEVELOPMENT PARK |
HUIZHOU CITY, GUANGDONG, CHINA 516006 |
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WITHROW + TERRANOVA, PLLC |
106 PINEDALE SPRINGS WAY |
CARY, NC 27511 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4001 E. HWY 54, SUITE 2000 |
DURHAM, NORTH CAROLINA 27709 |
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TAKAKO DIAUGUSTINE |
4001 E HWY 54, SUITE 2000 |
DURHAM, NC 27709 |
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Assignment:
5
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PATENT SECURITY AGREEMENT
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10 SOUTH DEARBORN |
MAIL CODE IL1-1190; FLOOR L2 |
CHICAGO, ILLINOIS 60603 |
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PAIGE BRINTON ESQ. |
SIMPSON THACHER & BARTLETT LLP |
425 LEXINGTON AVENUE |
NEW YORK, NY 10017 |
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