Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/01/2014
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Application #:
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12755929
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Filing Dt:
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04/07/2010
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Publication #:
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Pub Dt:
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10/13/2011
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Inventors:
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PIROOZ PARVARANDEH, Reynante Alvarado, Arkadii V. Samoilov, Chiung C. Lo
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Title:
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WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO MITIGATE FAILURES DUE TO STRESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 120 SAN GABRIEL DRIVE |
| SUNNYVALE, CALIFORNIA 94086 |
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| KEVIN E. WEST |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402 |
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