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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8742603
Issue Dt:
06/03/2014
Application #:
12882525
Filing Dt:
09/15/2010
Publication #:
20110285026
Pub Dt:
11/24/2011
Inventors:
Omar J. Bchir, Milind P. Shah, Sashidhar Movva
Title:
PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY THROUGH USE OF A BACKSIDE MOLD CONFIGURATION (BSMC)
Assignment: 1
Reel/Frame:
024992/0116Recorded: 09/15/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BCHIR, OMAR J.
Exec Dt:
09/02/2010
SHAH, MILING P.
Exec Dt:
09/02/2010
MOVVA, SASHIDHAR
Exec Dt:
09/02/2010
Assignee:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
PATENT DEPARTMENT
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
PATENT DEPARTMENT
SAN DIEGO, CA 92121-1714
Assignment: 2
Reel/Frame:
034751/0436Recorded: 01/12/2015Pages: 10
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNORS MIDDLE NAME PREVIOUSLY RECORDED AT REEL: 024992 FRAME: 0116. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
BCHIR, OMAR JAMES
Exec Dt:
12/10/2014
SHAH, MILIND PRAVIN
Exec Dt:
12/15/2014
MOVVA, SASHIDAR
Exec Dt:
01/09/2015
Assignee:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121

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