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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13066748
Filing Dt:
04/22/2011
Publication #:
Pub Dt:
12/15/2011
Inventors:
Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
Title:
Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder
Assignment: 1
Reel/Frame:
032913/0463Recorded: 05/14/2014Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2011
Assignee:
1000 INDEPENDENCE AVE., S. W
WASHINGTON, DISTRICT OF COLUMBIA USA 20585
Correspondent:
MICHAEL J. DOBBS
U. S. DEPT. OF ENERGY, IPLD
9800 S. CASS AVE
ARGONNE, IL 60439
Assignment: 2
Reel/Frame:
026827/0555Recorded: 08/23/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/09/2011
Exec Dt:
06/09/2011
Exec Dt:
06/09/2011
Assignee:
310 LAB OF MECHANICS
AMES, IOWA 50011-2131
Correspondent:
EDWARD J. TIMMER
121 EAST FRONT STREET, SUITE 205
TRAVERSE CITY, MI 49684

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