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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/10/2015
Application #:
12967839
Filing Dt:
12/14/2010
Publication #:
Pub Dt:
01/12/2012
Inventors:
Yueh-Ying Tsai, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
Title:
SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD THEREOF
Assignment: 1
Reel/Frame:
025499/0645Recorded: 12/14/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/31/2010
Exec Dt:
05/31/2010
Exec Dt:
05/31/2010
Exec Dt:
05/31/2010
Assignee:
NO. 123, SEC. 3, DA FONG ROAD, TANTZU
TAICHUNG, TAIWAN
Correspondent:
EDWARDS ANGELL PALMER & DODGE LLP
P.O. BOX 55874
BOSTON, MA 02205

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