Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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13092895
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Filing Dt:
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04/22/2011
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Publication #:
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Pub Dt:
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01/12/2012
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Inventor:
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Chih-kuang YANG
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Title:
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MULTI-LAYER VIA STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6 CREATION 4TH ROAD, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OFFICE NO. LB 16416, P.O. BOX 18246, JEBEL ALI |
| DUBAI, UNITED ARAB EMIRATES |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, CREATION 4TH RD. HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| EVAN R. WITT KIRTON & MCCONKIE |
| 36 SOUTH STATE STREET, SUITE 1900 |
| SALT LAKE CITY, UT 84111 |
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