Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/22/2012
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Application #:
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12980349
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Filing Dt:
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12/29/2010
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Publication #:
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Pub Dt:
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01/19/2012
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Inventors:
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Tai-Sheng Feng, Le-Tien Jung
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Title:
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MANUFACTURING METHOD FOR A BURIED CIRCUIT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.180, SEC 2, GONGDAO 5TH RD. |
| HSINCHU CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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