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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13067136
Filing Dt:
05/11/2011
Publication #:
Pub Dt:
02/02/2012
Inventors:
Jae Hun Kim, Ji Han Kwon, Ha Yoon Song, Young Seuck Yoo, Hee Jin Park, Jun Young Kim et al
Title:
Printed circuit board and manufacturing method thereof
Assignment: 1
Reel/Frame:
026374/0905Recorded: 05/11/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Exec Dt:
01/13/2011
Assignee:
314 MAETAN-3-DONG, YEONGTONG-GU
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Correspondent:
STAAS & HALSEY LLP
ATTENTION: DAVID M. PITCHER
1201 NEW YORK AVENUE, N.W.
SUITE 700
WASHINGTON, D.C. 20005

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