Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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13192913
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Filing Dt:
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07/28/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Inventor:
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Toshiyuki KOSAKA
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Title:
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PROCESS FOR DIVIDING WAFER INTO INDIVIDUAL CHIPS AND SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, KANAI-CHO, SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 244-0845 |
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| MICHAEL A. MAKUCH |
| 1130 CONNECTICUT AVENUE, N.W.,SUITE 1130 |
| SMITH, GAMBRELL & RUSSELL, LLP |
| WASHINGTON, DC 20036 |
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