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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/02/2013
Application #:
13202065
Filing Dt:
10/28/2011
Publication #:
Pub Dt:
02/16/2012
Inventors:
Yigal D. Blum, William Siu-Keung Chu, David Brent MacQueen, Yijian Shi
Title:
ENCAPSULATION METHODS AND DIELECTRIC LAYERS FOR ORGANIC ELECTRICAL DEVICES
Assignment: 1
Reel/Frame:
027144/0190Recorded: 10/28/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/19/2011
Exec Dt:
10/21/2011
Exec Dt:
10/19/2011
Exec Dt:
10/24/2011
Assignee:
333 RAVENSWOOD AVENUE
MENLO PARK, CALIFORNIA 94025-3493
Correspondent:
BOZICEVIC, FIELD & FRANCIS LLP
1900 UNIVERSITY AVENUE, SUITE 200
ATTN: ISAAC M. RUTENBERG
EAST PALO ALTO, CA 94303
Assignment: 2
Reel/Frame:
030220/0164Recorded: 04/16/2013Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/09/2012
Assignee:
1000 INDEPENDENCE AVE., S. W.
WASHINGTON, DISTRICT OF COLUMBIA 20585
Correspondent:
MARK P. DVORSCAK
U. S. DEPT. OF ENERGY, IPLD
9800 S. CASS AVE
ARGONNE, IL 60439

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