Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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12856699
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Filing Dt:
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08/16/2010
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Publication #:
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Pub Dt:
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02/16/2012
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Inventors:
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Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Title:
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MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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JOSEPH PETROKAITIS |
2070 RTE 52 |
482 |
HOPEWELL JCT, NY 12533 |
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