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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13185154
Filing Dt:
07/18/2011
Publication #:
Pub Dt:
03/01/2012
Inventors:
Soeren Zenner, Gotthard Jungnickel, Frank Kuechenmeister
Title:
Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process
Assignment: 1
Reel/Frame:
026608/0390Recorded: 07/18/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/14/2010
Exec Dt:
12/09/2010
Exec Dt:
12/01/2010
Assignee:
MAPLES CORPORATE SERVICES LIMITED
PO BOX 309, UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
J. MIKE AMERSON
10333 RICHMOND, SUITE 1100
HOUSTON, TX 77042
Assignment: 2
Reel/Frame:
056987/0001Recorded: 05/12/2021Pages: 1045
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/17/2020
Assignee:
440 STONE BREAK ROAD EXTENSION
MALTA, NEW YORK 12020
Correspondent:
BENJAMIN PETERSEN
1460 EL CAMINO REAL, 2ND FLOOR
SHEARMAN & STERLING LLP
MENLO PARK, CA 94025

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