Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12877796
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Filing Dt:
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09/08/2010
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Publication #:
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Pub Dt:
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03/08/2012
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Inventors:
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Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Keat Chuan Ng
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Title:
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LEAD FRAME PACKAGE WITH MULTIPLE BENDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. YISHUN AVE. 7 |
SINGAPORE, SINGAPORE 768923 |
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AVAGO TECHNOLOGIES LIMITED |
NO. YISHUN AVE. 7 |
SINGAPORE, 768923 SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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511 SAMSEONG-RO, GANGNAM-GU |
GOLDEN TOWER 10TH FLOOR |
SEOUL, KOREA, REPUBLIC OF 135-090 |
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SUNWOO LEE |
1030 15TH STREET, NW |
SUITE 380 EAST |
WASHINGTON, DC 20005 |
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