Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13226147
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Filing Dt:
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09/06/2011
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Publication #:
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Pub Dt:
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03/08/2012
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Inventors:
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Ray-Hua Horng, Jhih-Sin Hong, Shih-Feng Shao, Heng Liu
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Title:
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LED CHIP MODULES, METHOD FOR PACKAGING THE LED CHIP MODULES, AND MOVING FIXTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, UNIVERSITY ROAD |
| TAINAN CITY, TAIWAN 701 |
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| 8F.-9, NO.51, SEC.2, KEELUNG RD., XINYI DIST. |
| TAIPEI CITY, TAIWAN 110 |
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| TAYSIE J. LOCKE |
| 1900 MESA AVE. |
| COLORADO SPRINGS, CO 80906 |
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