Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13240764
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Filing Dt:
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09/22/2011
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Publication #:
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Pub Dt:
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03/22/2012
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Inventors:
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Sung Chul Kim, Seung Jun Jang, Yong Un Jang, Yoon Sang Son, Yong Cheol Chu
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Title:
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SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 597-3 YEONAM-DONG, BUK-GU |
| ULSAN, KOREA, REPUBLIC OF 683-804 |
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| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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