Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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13172175
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Filing Dt:
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06/29/2011
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Publication #:
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Pub Dt:
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04/05/2012
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Inventor:
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Hsien Chia Lin
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Title:
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LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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302 ROOM NO. 6 HALL NO. 88, DARWIN ROAD |
ZHANGJIANG, PUDONG, SHANGHAI, CHINA |
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NO. 25, LN. 76, SEC. 3, ZHONGYANG RD., TUCHENG DIST. |
NEW TAIPEI CITY, TAIWAN 236 |
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HAN IP LAW PLLC |
P.O. BOX 2087 |
BOTHELL, WA 98041-2087 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6-8, ZHONGHUA ROAD, SHULIN DISTRICT |
NEW TAIPEI CITY, TAIWAN 23860 |
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HAN IP LAW PLLC |
P.O. BOX 2087 |
BOTHELL, WA 98041-2087 |
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