Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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13323634
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Filing Dt:
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12/12/2011
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Publication #:
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Pub Dt:
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04/05/2012
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Inventors:
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Hong XIAO, Jack Y. JAU, Chang Chun YEH
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Title:
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STRUCTURE AND METHOD FOR DETERMINING A DEFECT IN INTEGRATED CIRCUIT MANUFACTURING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 18, CREATION ROAD 1, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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