Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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12913122
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Filing Dt:
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10/27/2010
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Publication #:
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Pub Dt:
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05/03/2012
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Inventors:
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BengKit Kuah, Lucas KongYaw Lee, William L. Rugg, SaiPo Yuen, William BS Koh et al
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Title:
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Assessing Connection Joint Coverage Between a Device and a Printed Circuit Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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920 DISC DRIVE |
SCOTTS VALLEY, CALIFORNIA 95066 |
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FELLERS, SNIDER, ET AL. |
100 NORTH BROADWAY, SUITE 1700 |
OKLAHOMA CITY, OK 73102-8820 |
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Assignment:
2
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GWS LOAN OPERATIONS |
720 KING STREET WEST, 2ND FLOOR |
TORONTO, CANADA M5V 2T3 |
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MINDY M. LOK, ESQ. |
SIMPSON THACHER & BARTLETT LLP |
425 LEXINGTON AVENUE |
NEW YORK, NY 10017 |
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