Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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13285912
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Filing Dt:
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10/31/2011
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Publication #:
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Pub Dt:
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05/03/2012
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Inventors:
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Venkatesh V. Sundaram, Rao R. Tummala
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Title:
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ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 505 TENTH STREET, NW |
| ATLANTA, GEORGIA 30332-0415 |
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| RYAN A. SCHNEIDER |
| 600 PEACHTREE STREET, NE, SUITE 5200 |
| BANK OF AMERICA PLAZA |
| ATLANTA, GA 30308-2216 |
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