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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13079306
Filing Dt:
04/04/2011
Publication #:
20120115308
Pub Dt:
05/10/2012
Inventors:
Chang-Huang HUA, Ping Wei CHEN, Chen-Che CHIN, Benny HO, Kevin HUANG
Title:
FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER CUTTING TECHNIQUES
Assignment: 1
Reel/Frame:
026071/0690Recorded: 04/04/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUA, CHANG-HUANG
Exec Dt:
03/02/2011
CHEN, PING WEI
Exec Dt:
03/02/2011
HUANG, KEVIN
Exec Dt:
03/02/2011
HO, BENNY
Exec Dt:
03/03/2011
CHIN, CHEN-CHE
Exec Dt:
03/02/2011
Assignee:
WIN SEMICONDUCTORS CORP.
NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK
KUEI SHAN HSIANG
TAO YUAN SHIEN, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PLLC
4000 LEGATO ROAD
SUITE 310
FAIRFAX, VA 22033

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