Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13050945
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Filing Dt:
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03/18/2011
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Publication #:
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Pub Dt:
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05/24/2012
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Inventors:
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Wei-Chih Lai, Jiang Fan
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Title:
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INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F, 533, ZHONGZHENG RD., XINDIAN DIST. |
NEW TAIPEI CITY, TAIWAN 231 |
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JIANQ CHYUN INTELLECTUAL PROPERTY |
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
TAIPEI, 100 TAIWAN |
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