Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007485
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Filing Dt:
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01/11/2008
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Publication #:
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Pub Dt:
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05/31/2012
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Inventors:
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John S. Foster, Jeffery F. Summers
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Title:
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Deposition/bonding chamber for encapsulated microdevices and method of use
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 75 ROBIN HILL ROAD |
| GOLETA, CALIFORNIA 93117 |
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| JAQUELIN K. SPONG |
| 2139 DOMINION WAY |
| FALLS CHURCH, VA 22043 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 812 ANACAPA STREET, SUITE A |
| SANTA BARBARA, CALIFORNIA 93101 |
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| PATTY CHENG |
| 2625 MIDDLEFIELD ROAD, SUITE 215 |
| PALO ALTO, CA 94306 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 75 ROBIN HILL ROAD |
| GOLETA, CALIFORNIA 93117 |
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| PATTY CHENG |
| 2625 MIDDLEFIELD RD., #215 |
| PALO ALTO, CA 94306 |
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