Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13299531
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Filing Dt:
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11/18/2011
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Publication #:
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Pub Dt:
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05/31/2012
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Inventors:
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Julien Pruvost, Jerome Lopez, Jean-Michel Riviere
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Title:
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SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD OF FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, RUE JULES HOROWITZ |
| GRENOBLE, FRANCE F-38000 |
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| GARDERE WYNNE SEWELL LLP INTELLECTUAL PR |
| 3000 THANKSGIVING TOWER |
| 1601 ELM ST |
| DALLAS, TX 75201-4761 |
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