Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/04/2013
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Application #:
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13120988
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Filing Dt:
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08/17/2011
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Publication #:
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Pub Dt:
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05/31/2012
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Inventors:
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Willem Frederik Adrianus Besling, Freddy Roozeboom, Yann Pierre Roger Lamy
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Title:
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METHOD OF PLATING THROUGH WAFER VIAS IN A WAFER FOR 3D PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD |
6 SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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THOMAS, KAYDEN, HORSTEMEYER & RISLEY, LL |
400 INTERSTATE NORTH PARKWAY SE |
SUITE 1500 |
ATLANTA, GA 30339 |
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