Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13064725
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Filing Dt:
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04/11/2011
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Publication #:
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Pub Dt:
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06/14/2012
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Inventors:
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Youngnam HWANG, Hyunjik YANG, Dongik SHIN
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Title:
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Thermoelectric module and method of sealing the same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU |
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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STAAS & HALSEY LLP |
ATTENTION. DAVID M PITCHER |
1201 NEW YORK AVE, N.W, SUITE 700 |
WASHINGTON, D C. 20005 |
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