Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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13031861
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Filing Dt:
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02/22/2011
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Publication #:
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Pub Dt:
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06/21/2012
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Inventors:
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Jae-Hak Lee, Chang-Woo Lee, Joon-Yub Song, Tae-Ho Ha
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Title:
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METHOD OF FABRICATING A TSV FOR 3D PACKAGING OF SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 171, JANG-DONG, YOUSEONG-KU |
| DAEJEON-CITY, KOREA, REPUBLIC OF 305-343 |
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| LEXYOUME IP GROUP, PLLC |
| 5180 PARKSTONE DRIVE, SUITE 175 |
| CHANTILLY, VA 20151 |
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