Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13313114
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Filing Dt:
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12/07/2011
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Publication #:
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Pub Dt:
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06/21/2012
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Inventor:
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Georg Pietsch
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Title:
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METHOD FOR THE SIMULTANEOUS MATERIAL-REMOVING PROCESSING OF BOTH SIDES OF AT LEAST THREE SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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| LEYDIG, VOIT & MAYER, LTD. |
| 180 NORTH STETSON AVENUE |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| CHICAGO, IL 60601-6731 |
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Assignment:
2
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| EINSTEINSTRASSE 172 |
| 81677 MÜNCHEN, GERMANY |
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| DANIEL M. GURFINKEL |
| DENNEMEYER & ASSOCIATES, LLC |
| 2 NORTH RIVERSIDE PLAZA, SUITE 1500 |
| CHICAGO, IL 60606 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE DATE OF THE CHANGE OF ADDRESS FROM 03/12/2020 TO 12/03/2020 PREVIOUSLY RECORDED AT REEL: 056719 FRAME: 0881. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| EINSTEINSTRASSE 172 |
| 81677 MÜNCHEN, GERMANY |
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| DANIEL M. GURFINKEL |
| DENNEMEYER & ASSOCIATES, LLC |
| 2 NORTH RIVERSIDE PLAZA, SUITE 1500 |
| CHICAGO, IL 60606 |
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