Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13043476
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Filing Dt:
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03/09/2011
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Publication #:
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Pub Dt:
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06/28/2012
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Inventors:
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Chien-Sen Weng, Meng-Yeng Xing, Chih-Sheng Chen, Wei-Chang Yu, Yu-Ching Chang
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Title:
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WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, GONGYE E. 3RD RD., HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30075 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F.-1, NO.100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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