Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2014
|
Application #:
|
13278351
|
Filing Dt:
|
10/21/2011
|
|
Publication #:
|
|
Pub Dt:
|
06/28/2012
| | | | |
|
Inventors:
|
Peter V. Loeppert, Daniel Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
|
|
Title:
|
PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1151 MAPLEWOOD DRIVE |
| ITASCA, ILLINOIS 60143 |
|
|
|
|
| TIMOTHY R. BAUMANN |
| 120 SOUTH LA SALLE STREET, SUITE 1600 |
| CHICAGO, IL 60603 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1151 MAPLEWOOD DRIVE |
| ITASCA, ILLINOIS 60143 |
|
|
|
|
| TIMOTHY R. BAUMANN |
| 120 SOUTH LA SALLE STREET, SUITE 1600 |
| CHICAGO, IL 60603 |
|
|
Search Results as of:
06/27/2024 12:47 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
