Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13330719
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Filing Dt:
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12/20/2011
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Publication #:
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Pub Dt:
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06/28/2012
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Inventors:
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Kwang-Seong Choi, Yong Sung Eom, Hyun-cheol Bae, Jong Tae Moon
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Title:
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COMPOSITION FOR FILLING A THROUGH SILICON VIA (TSV) AND SUBSTRATE INCLUDING TSV PLUG FORMED USING THE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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161, GAJEONG-DONG, YUSEONG-GU |
DAEJEON, KOREA, REPUBLIC OF 305-700 |
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RABIN & BERDO, P.C. |
1101 14TH ST., N.W., SUITE 500 |
WASHINGTON, DC 20005 |
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Assignment:
2
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ACKNOWLEDGEMENT OF PATENT EXCLUSIVE LICENSE AGREEMENT
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10TH FLOOR, GOLDEN TOWER, 511, SAMSUNG-RO, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF 135-090 |
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H.C. PARK & ASSOCIATES, PLC |
1894 PRESTON WHITE DRIVE |
RESTON, VA 20191 |
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