Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13417603
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Filing Dt:
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03/12/2012
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Publication #:
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Pub Dt:
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07/05/2012
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Inventors:
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Ming Sun, Demei Gong
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Title:
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Method of Making a Low Profile Flip Chip Power Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANNON S COURT 22, VICTORIA STREET, |
| HAMILTON HM12, BERMUDA HM12 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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