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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13326370
Filing Dt:
12/15/2011
Publication #:
Pub Dt:
07/26/2012
Inventors:
Ming-Hung Lin, Tasi-Tung Kuo, Kuan-Cheng Liu, Ying-Chien Lee, Kuo-Pin Chiu
Title:
Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
Assignment: 1
Reel/Frame:
027394/0093Recorded: 12/15/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/25/2011
Exec Dt:
05/25/2011
Exec Dt:
05/25/2011
Exec Dt:
05/25/2011
Exec Dt:
05/25/2011
Assignee:
NO. 7-1, MINZU ROAD, DAYUAN TOWNSHIP
TAOYUAN COUNTY, TAIWAN 33759
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314-1176

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