Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13329546
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Filing Dt:
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12/19/2011
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Publication #:
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Pub Dt:
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07/26/2012
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Inventors:
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Po-Yuan HSU, Wei-Cheng Wang, Chen-Yu Li, Hsing-Wang Chang, Tsung-Hsien Chen et al
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Title:
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Assembly of an Electronic Device Casing, A Heat-Dissipating Module and a Waterproofing Module, and the Waterproofing Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21F, NO. 88, SECTION 1 |
| HSIN TAI WU ROAD, HSICHIH DISTRICT |
| NEW TAIPEI CITY, TAIWAN 22181 |
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| JOHN A. FORTKORT |
| 9442 N. CAPITAL OF TEXAS HIGHWAY |
| 1-500 |
| AUSTIN, TX 78759 |
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