Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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13313349
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Filing Dt:
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12/07/2011
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Publication #:
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Pub Dt:
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08/02/2012
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Inventors:
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Toshiya Akamatsu, Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi et al
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Title:
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SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| KRATZ, QUINTOS & HANSON, LLP |
| 4TH FLOOR |
| 1420 K STREET, N.W. |
| WASHINGTON, DC 20005 |
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