Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13019126
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Filing Dt:
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02/01/2011
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Publication #:
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Pub Dt:
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08/02/2012
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Inventors:
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Chin-Tien Chiu, Chih-Chin Liao, Peng Fu
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Title:
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GLOB TOP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388 JIANG CHUAN EAST ROAD |
| MINHANG DISTRICT |
| SHANGHAI, CHINA 200241 |
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| VIERRA MAGEN MARCUS & DENIRO LLP |
| 575 MARKET STREET |
| SUITE 2500 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388 JIANG CHUAN EAST ROAD |
| MINHANG DISTRICT |
| SHANGHAI, CHINA 200241 |
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| VIERRA MAGEN MARCUS & DENIRO LLP |
| 575 MARKET STREET |
| SUITE 2500 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE LISTING OF ASSIGNORS BY REMOVING CHIH-CHIN LIAO AND REPLACING WITH PENG FU PREVIOUSLY RECORDED ON REEL 025913 FRAME 0990. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT ASSIGNOR IS PENG FU.
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| NO. 388 JIANG CHUAN EAST ROAD |
| MINHANG DISTRICT |
| SHANGHAI, CHINA 200241 |
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| VIERRA MAGEN MARCUS & DENIRO LLP |
| 575 MARKET STREET, SUITE 2500 |
| SAN FRANCISCO, CA 94105 |
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