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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13105325
Filing Dt:
05/11/2011
Publication #:
20120286416
Pub Dt:
11/15/2012
Inventors:
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba et al
Title:
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
Assignment: 1
Reel/Frame:
027944/0480Recorded: 03/27/2012Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SATO, HIROAKI
Exec Dt:
06/30/2011
HASHIMOTO, YUKIO
Exec Dt:
06/30/2011
NAKADAIRA, YOSHIKUNI
Exec Dt:
06/30/2011
MASUDA, NORIHITO
Exec Dt:
06/30/2011
HABA, BELGACEM
Exec Dt:
09/09/2011
MOHAMMED, ILYAS
Exec Dt:
11/02/2011
DAMBERG, PHILIP
Exec Dt:
11/10/2011
Assignee:
TESSERA RESEARCH LLC
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
DAVY E. ZONERAICH
LERNER, DAVID, LITTENBERG, KRUMHOLZ
& MENTLIK, LLP
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090
Assignment: 2
Reel/Frame:
028036/0989Recorded: 04/11/2012Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TESSERA RESEARCH LLC
Exec Dt:
03/23/2012
Assignee:
TESSERA, INC.
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
DAVY E. ZONERAICH
LERNER, DAVID, LITTENBERG, KRUMHOLZ ET AL.
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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