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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/16/2014
Application #:
13463130
Filing Dt:
05/03/2012
Publication #:
Pub Dt:
11/15/2012
Inventors:
Hussein S. El-Ghoroury, Chih-Li Chuang, Kameshwar Yadavalli, Qian Fan
Title:
Semiconductor Wafer Bonding Incorporating Electrical and Optical Interconnects
Assignment: 1
Reel/Frame:
028338/0091Recorded: 06/07/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2012
Exec Dt:
05/02/2012
Exec Dt:
05/02/2012
Exec Dt:
05/02/2012
Assignee:
6185 PASEO DEL NORTE, SUITE 200
CARLSBAD, CALIFORNIA 92011
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085

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