Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13511112
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Filing Dt:
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05/21/2012
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Publication #:
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Pub Dt:
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12/13/2012
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Inventors:
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Seok-Kee Hong, Young-Hwan Lim, Si-Eun Yang, Dong Young Jang, Ho-Jin Hwang, Chang-Woo Ban
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Title:
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INSPECTION DEVICE FOR BONDED WAFER USING LASER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 172 GONGNEUNG-DONG, NOWON-GU, |
| SEOUL, KOREA, REPUBLIC OF 139-240 |
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| JAMES E. BAME |
| IPLA P.A. |
| 3550 WILSHIRE BLVD. 17TH FLOOR |
| LOS ANGELES, CA 90010 |
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