Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13181274
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Filing Dt:
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07/12/2011
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Publication #:
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Pub Dt:
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01/17/2013
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Inventors:
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Samuel J. Anderson, Thomas B. Smiley
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Title:
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Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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P.O. BOX 24619 |
TEMPE, ARIZONA 85285 |
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PATENT LAW GROUP |
605 W. KNOX ROAD |
SUITE 104 |
TEMPE, AZ 85284 |
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