Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13182220
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Filing Dt:
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07/13/2011
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Publication #:
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Pub Dt:
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01/17/2013
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Inventors:
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Hiren D. Thacker, John E. Cunningham, Ivan Shubin, Ashok V. Krishnamoorthy
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Title:
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INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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500 ORACLE PARKWAY |
MAIL STOP 5OP7 |
REDWOOD CITY, CALIFORNIA 94065 |
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A. RICHARD PARK |
PARK, VAUGHAN, FLEMING & DOWLER LLP |
2820 FIFTH STREET |
DAVIS, CA 95618 |
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