Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/10/2014
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Application #:
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13198767
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Filing Dt:
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08/05/2011
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Publication #:
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Pub Dt:
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02/07/2013
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Inventors:
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Yi-Yang LEI, Hung-Jui KUO, Chung-Shi LIU, Mirng-Ji LII, Chen-Hua YU
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Title:
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CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| WON-JOON KOUH, DUANE MORRIS LLP |
| 30 S. 17TH ST. |
| PHILADELPHIA, PA 19103 |
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