Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13207886
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Filing Dt:
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08/11/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Inventors:
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Benjamin Michael FINNEY, Erik Alan HOLVERSON, Cody Allen BALK
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Title:
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Three-Dimensionally Molded Electronic Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1209 ORANGE STREET |
| THE CORPORATION TRUST CENTER |
| WILMINGTON, DELAWARE 19801 |
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| FISH & RICHARDSON P.C. |
| P.O. BOX 1022 |
| MINNEAPOLIS, MN 55440-1022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 295 PHILLIP STREET |
| WATERLOO, ONTARIO N2L 3W8 |
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| RESEARCH IN MOTION LIMITED - JAMIE-LYN |
| 1875 BUCKHORN GATE |
| MISSISSAUGA, ONC L4W 5P1 |
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